As a Principal Engineer you have obtained a broad, in-depth and hands-on knowledge of wafer bonding & advanced packaging processes in the semiconductor industry.
Your main responsibilities will include:
- Using your expertise, you will support the team members during technical and engineering challenges.
- You will coach and develop the team to bring the processes we support toward a higher maturity level.
- Using your industry background, you support the team with setting up efficient POR’s & standardizing our way of working.
- You stay abreast of new developments and technologies in the field of wafer bonding and advanced packaging, and you are responsible for distributing this knowledge to the relevant stakeholders.
- You translate the needs of the area, the FAB and imec into roadmaps.
- You build bridges to other groups and departments, and you are the scientific spokesperson for the group and department in various fora.
- You provide strategic technical leadership and ensure systematic follow-up on long-term initiatives, including internal improvement projects, customer collaborations, and market exploration for tool acquisitions.
- Occasionally you publish your results in high-impact journals, conferences and technical seminars
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will define the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.
You have at least a Master’s degree in Applied Sciences, Chemistry, Physics, Material Engineering or equivalent through experience, with at least 10-year work experience in the semiconductor industry related to wafer bounding & advanced packaging.
You have a strong technical, hands-on & scientific background.
You have a good understanding of wafer bonding & advanced packaging challenges in semiconductor technology combined with solid knowledge of device integration and the different process steps to build these devices
You have experience working with internal and external customers including leading edge semiconductor equipment manufacturers.
You are a team player and flexible in accommodating changing priorities to support business needs.
You are self-motivated, responsible and are willing to take ownership.
You feel at home and know how to integrate into a multicultural environment
You have outstanding English communication skills to work successfully in an international dynamic team environment.
IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.
